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Symposium on Solder Pages: 195       Published: 1957

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Table of Contents

Introduction
Gonser Bruce

Solders, Fluxes, and Techniques for Soldering Aluminum
Dowd J.

Ultrasonic Soldering of Aluminum
Jones J., Thomas John

Dip Soldering Printed Circuits
Miller Eugene, Johns Alfred

Soldering in Semiconductor Devices
Lootens W.

Industrial Survey of Paste Solder Alloys
Williams Harold

Corrosive FluxesTheir Role in Soldering
MacIntosh Robert

The Use of Rosin and Activated Rosin Fluxes
Disque Frederick

Soldering Fluxes and Flux Principles
Mample A.

Non-Corrosive FluxesEvaluation of Spread and Corrosion Properties
Sohl H.

A Method for Testing and Evaluating the Joint Properties of a Copper Liner Soldered in an Aluminum Casting
Davis Moss

The Performance of Some Soft Solders at Elevated Temperatures and Pressures
Pattee H., Evans R.

Dip-Soldered Printed Circuit Joint Characteristics
Johns Alfred, Miller Eugen

Tin Disease in Solder Type Alloys
Bornemann Alfred

Gray Tin Formation in Soldered Joints Stored at Low Temperature
Williams W.

Proposed Numerical Evaluation System for Soft Solders, Solder Fluxes, and Solderability
Pessel L.

Controlling Quality on Soldered Electrical Connections
Rombach W.

Symposium Summation
Harnden G.

Committee: B02
Paper ID: STP189-EB
DOI: 10.1520/STP189-EB

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STP189-EB