SYMPOSIA PAPER Published: 01 January 1957
STP44115S

Dip-Soldered Printed Circuit Joint Characteristics

Source

Considerable emphasis has been placed upon a program of investigation of dipsoldered joints from the standpoint of results which can be anticipated in production. This program covers four fields of information on dip-soldered joints:

1. Efficiency of joint formation.

2. Short-time tensile strength.

3. Impact strength in tension.

4. Creep strength in tension.

Author Information

Johns, Alfred
Navy Ordnance Div., Eastman Kodak Co., Rochester, N. Y.
Miller, Eugen
Navy Ordnance Div., Eastman Kodak Co., Rochester, N. Y.
Price: $25.00
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Details
Developed by Committee: B02
Pages: 115–128
DOI: 10.1520/STP44115S
ISBN-EB: 978-0-8031-5938-9
ISBN-13: 978-0-8031-6092-7