SYMPOSIA PAPER Published: 01 January 1989

Investigation into Thermal Conductivity of Composite Materials for Electronics Packaging


As part of a two-year investigation into the use of composite materials for military electronic equipment enclosures, the thermal conductivity of composite materials was determined by testing and predicted by an analytical technique. The objectives included identifying methods of improving thermal conductivity of composites and utilization of a prediction method. The comparative test and the Lewis-Nielson semitheoretical prediction methods were used and are described. The materials evaluated were a thermoplastic polymer with several discontinuous filler types. The analytical predictions were in good agreement with the test results except at high filler levels, but do not take into account anisotropic material properties or temperature effects. Test and prediction results are presented.

Author Information

Hoffman, RR
Magnavox G&I Electronics Co., Fort Wayne, IN
Tye, RP
Dynatech R/D Co., Cambridge, MA
Chervenak, JG
Dynatech R/D Co., Cambridge, MA
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Developed by Committee: D30
Pages: 146–153
DOI: 10.1520/STP24600S
ISBN-EB: 978-0-8031-5099-7
ISBN-13: 978-0-8031-1272-8