STP676

    A Phenomenology of Room-Temperature Stress Relaxation in Cold-Rolled Copper Alloys

    Published: Jan 1979


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    Abstract

    Room-temperature tension stress relaxation tests on two copper alloys—CDA 510 and CDA 638—were conducted to determine if structural changes accompany stress relaxation. Changes in relaxation rate and in the shape of the tensile stress-strain curves as a result of stress relaxation were analyzed. The results indicate that structural changes during stress relaxation are brought about by a dislocation rearrangement process akin to recovery. Mobile dislocation density was found to change during testing, and work hardening did not contribute in decreasing the relaxation rate.

    Keywords:

    stress relaxation, mechanical properties, copper alloys, dislocations, recovery, thermal activation


    Author Information:

    Parikh, P
    Engineering specialist and supervisor, Mechanical Metallurgy Group, Olin Metals Research Laboratories, New Haven, Conn.

    Shapiro, E
    Engineering specialist and supervisor, Mechanical Metallurgy Group, Olin Metals Research Laboratories, New Haven, Conn.


    Paper ID: STP37414S

    Committee/Subcommittee: E28.11

    DOI: 10.1520/STP37414S


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