You are being redirected because this document is part of your ASTM Compass® subscription.
    This document is part of your ASTM Compass® subscription.


    Packing to Reduce Electrostatic Discharge Damage and Related Testing

    Published: Jan 1988

      Format Pages Price  
    PDF (196K) 14 $25   ADD TO CART
    Complete Source PDF (1.2M) 14 $55   ADD TO CART


    The protection of electronic components from electrostatic discharge (ESD) is a prime concern at RCA. To establish and support an effective antistatic packing program, various materials were tested and testing methods evaluated. This paper presents the data compiled over two years of application of the static decay and triboelectric testing methods. The data demonstrates that a topically coated PVC tube, in a foil-lined sleeve, is a cost-effective, state-of-the-art method of packing semiconductor devices.


    electrostatic discharge (ESD), IC packing, IC protection

    Author Information:

    Murello, AF
    RCA, Somerville, NJ

    Committee/Subcommittee: D10.13

    DOI: 10.1520/STP26370S

    CrossRef ASTM International is a member of CrossRef.