Journal Published Online: 16 June 2023
Volume 12, Issue 1

Effect of the Solder Powder Size of Sn-Bi-Ag-In Lead-Free Solder on the Wettability and Microstructure of Cu Substrate

CODEN: MPCACD

Abstract

In this study, tin-bismuth-silver-indium (Sn-Bi-Ag-In) lead-free solder powders are prepared by the consumable-electrode direct current arc (CDCA) method. Without agglomeration, the satellite-free solder powders show good sphericity. The effect of solder powder sizes on the wettability and microstructure of Sn-Bi-Ag-In solder alloy on copper substrate is systematically investigated. The solder joints prepared by solder powder in a size of 53–120 μm exhibit relatively small wetting angles. In addition, the microstructure of the solder joints is composed of bismuth-rich phases, tin-rich phases, and Ag3Sn phases. A continuous intermetallic compound (IMC) layer with a thickness in the range of 0.64–0.70 μm is formed at the interface between the solder and the copper substrate. The results show that the formation and morphology variety of the IMC layers for different solder joints are unobvious, reflecting the good wettability of the Sn-Bi-Ag-In lead-free solder powders on the copper substrate in a wide size range.

Author Information

Hu, Tianhan
State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai, PR China
Li, Zhen
State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai, PR China
Wu, Guanzhi
State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai, PR China
Li, Shun
State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai, PR China
Ding, Kai
State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai, PR China
Gao, Yulai
State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai, PR China Shanghai Engineering Research Center for Metal Parts Green Remanufacture, Shanghai University, Shanghai, PR China
Pages: 12
Price: $25.00
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Details
Stock #: MPC20230003
ISSN: 2379-1365
DOI: 10.1520/MPC20230003