Apr 06, 2022

The Symposium on Medical Devices of the Future – What’s Needed for Fatigue, Fracture Resistance, and Durability of Exoskeletons and Exosuits? will be held Nov. 1–2, 2022, at the Sheraton New Orleans Hotel, New Orleans (Louisiana, USA).

The symposium is sponsored by ASTM International’s committees on fatigue and fracture (E08), medical and surgical materials and devices (F04), and exoskeletons and exosuits (F48) in conjunction with the November standards development meetings of the committees.

The objective of this symposium is to provide a forum for the presentation and discussion of contemporary design and material requirements and to address methodologies in fatigue crack initiation, crack propagation, and failure analyses employed in ground vehicle, aircraft, aerospace, and medical devices that may be employed in exosuits and exoskeletons.

Topics for the symposium may include but are not limited to:

• Environmental Parameters / Material Behavior;
• Standard Methodologies to Characterize Materials Employed in Medical and Exoskeleton/Exosuit Design;
• Strain-based and Stress-based Fatigue Behavior;
• Fracture Mechanics Behavior;
• Deformation Characteristics;
• Characterization of Material/Device for Design Reliability;
• Mean Strain, Mean Stress Response of Nitinol;
• Lifetime Prediction Techniques for Medical and Exoskeleton/Exosuit Devices;
• Metallurgy, Microstructures and Mechanical Properties;
• Processing Parameters / Material Behavior;
• Simulation Characterizations and Applications to Design and Prediction; and
• Material Selection for Biocompatibility and/or Wearability.

For more information, visit https://na.eventscloud.com/website/34389/sympmeddevicesfuture/.

Additional technical information is available from symposium co-chairs M.R. Mitchell (mrmitchell@illinoisalumni.org); Janet Gbur (jlg120@case.edu); Don Peterson (drpeterson@niu.edu); Terry Woods (terry.woods@fda.hhs.gov); and Brian Berg (bergb@bsci.com).


Symposia Operations Contact: Jennifer Buono, tel+1.610.832.9698; symposia@astm.org

Release #11394
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