Mar 08, 2011

A new publication available from ASTM International, STP 1530, Lead-free Solders, is a valuable resource for students, researchers and material scientists in the electronic industry.

STP 1530 includes 11 peer-reviewed papers that address the environmental and health concerns related to the exposure to lead during soldering and the success and failures of lead-free solders. Topics cover:

• Factors affecting the wetting behavior of solders and evolution of interfacial microstructure;
• Pb-free high temperature solders for power semiconductor devices;
• Effect of surface roughness on wetting behavior and evolution of microstructure of two lead free solders on copper substrates;
• Fatigue life of SnBi Finished thin-small-outline-package (TSOP) parts under thermal cycling 
• Microstructural aspects of the ductile-to-brittle transition;
• Loading mixity on the interfacial failure mode in lead-free solder joint;
• Solder joint strengths of BGA (Ball Grid Array) lead-free to that of eutectic lead (Sn-Pb) solder joint strengths;
• Effect of the morphology of Cu6Sn5 intermetallic compound on tensile properties of bulk solder and solder joint;
• Tensile properties of Sn-10Sb-5Cu high temperature lead free solder; and
• Empirical modeling and rheological characterization of solder pastes used in electronic assemblies. 

STP 1530, Lead-free Solders, is available for $62 USD in print (210 pages; 6” x 9” soft cover; ISBN: 978-0-8031-7516-7; Stock #: STP1530) or as an e-book (ISBN: 978-0-8031-8683-5; E-book Stock #: STP1530-EB). 

To purchase ASTM publications, search by stock number on the ASTM Web site (www.astm.org), or contact ASTM Customer Relations (phone: 610-832-9585; https://www.astm.org/contact/).

ASTM Staff Contact: Marsha Firman, Phone: 610-832-9612; mfirman@astm.org

Release #8804