Committee F01 Subcommittees

Staff Manager: Kelly Paul

Subcommittees and Standards

Standards under the jurisdiction of F01

Each main committee in ASTM International is composed of subcommittees that address specific segments within the general subject area covered by the technical committee. Click on the subcommittee links below to see the title of existing standards for each subcommittee. Then, click on the resulting titles to see the standard's scope, referenced documents, and more.

  • F01.03 Metallic Materials, Wire Bonding, and Flip Chip
  • F01.10 Contamination Control
  • F01.11 Nuclear and Space Radiation Effects
  • F01.15 Compound Semiconductors
  • F01.17 Sputter Metallization
  • F01.18 Printed Electronics
  • F01.90 Executive
  • F01.95 Reference Materials