STP Published: 1988

Adhesively Bonded Joints: Testing, Analysis, and Design

Editor(s): W S Johnson

Twenty-one papers present the latest advances in the understanding of mechanical behavior of adhesives. Their focus is on aircraft and naval applications. The mechanical testing section discusses techniques and specimen designs for determining tensile, shear, and mixed-mode properties of adhesives. Papers on stress analysis consider both analytical and experimental methods to analyze the stress in an adhesively bonded joint. In the section on failure mechanisms examples are presented for several types of adherents and specimen geometries. The final section considers design and durability of bonded joints.

Table of Contents

WS Johnson

GP Anderson, S Chandapeta, KL DeVries

KM Liechti, EC Hanson

V Weissberg, M Arcan

Y Gilibert, MLL Klein, A Rigolot

D Jangblad, P Gradin, T Stenström

J Spingarn

DA Dillard, KM Liechti, DR Lefebvre, C Lin, JS Thornton, HF Brinson

HL Groth

D Post, R Czarnek, JD Wood, D Joh

JH Crews, KN Shivakumar, IS Raju

S Aivazzadeh, M Bichara, A Ghazal, G Verchery

Y Gilibert, A Rigolot

EJ Ripling, PB Crosley, WS Johnson

E Ziane, C Coddet

S Mall, WS Johnson

CA Bigelow

P Albrecht, AH Sahli

JM Miller, JL Hammill, KE Luyk

RB Krieger

RA Jurf

LR Pitrone, SR Brown

WS Johnson

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Developed by Committee: D14
Pages: 320
DOI: 10.1520/STP981-EB
ISBN-EB: 978-0-8031-5051-5
ISBN-13: 978-0-8031-0993-3