STP Published: 1985

Delamination and Debonding of Materials

Editor(s): W S Johnson

Discusses the analysis, testing, and detection of the delamination of composite materials and the debonding of adhesive joints. 25 papers examine stress analysis, mechanical behavior, and fractography/NDI.

Table of Contents

WS Johnson

A-Y Kuo, S-S Wang

P Conti, A De Paulis

RR Valisetty, LW Rehfield

JD Whitcomb, IS Raju

JM Mahishi, DF Adams

GP Anderson, KL DeVries, G Sharon

ASD Wang, M Slomiana, RB Bucinell

T Mohlin, AF Blom, LA Carlsson, AI Gustavsson

WS Johnson, S Mall

C-G Gustafson, L Jilkèn, PA Gradin

C Bathias, A Laksimi

LJ Hart-Smith

RA Everett, WS Johnson

TK O'Brien

JM Whitney, M Knight

RL Ramkumar, JD Whitcomb

AA Aliyu, IM Daniel

AJ Russell, KN Street

LA Mignery, TM Tan, CT Sun

WL Bradley, RN Cohen

Johannesson T, Blikstad M

CE Harris, DH Morris

Gustafson C-G, Seldén RB

VH Kenner, GH Staab, H-S Jing

DJ Hillman, RL Hillman

WS Johnson

Index Free

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Developed by Committee: D30
Pages: 499
DOI: 10.1520/STP876-EB
ISBN-EB: 978-0-8031-4941-0
ISBN-13: 978-0-8031-0414-3