SYMPOSIA PAPER Published: 01 January 1962

Physical and Mechanical Properties of Electroformed Copper


Temperature, current density, and other process variables influence the properties and the structures of electroformed copper. The effects of only a few addition agents have been evaluated. Data on the effects of impurities are lacking. Structures of typical electroformed copper are correlated in this discussion with the available data on properties.

Author Information

Safranek, W., H.
Battelle Memorial Inst., Columbus, Ohio
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Developed by Committee: B08
Pages: 44–55
DOI: 10.1520/STP46003S
ISBN-EB: 978-0-8031-6748-3
ISBN-13: 978-0-8031-6596-0