SYMPOSIA PAPER Published: 01 January 1963

Printed Wiring Surface Preparation Methods—Elimination of Gold Plating as a Surface Preparation for Printed Circuits and Development of a Contamination-Free Surface


Soldering at Martin-Orlando is one of the most important operations in the production of missile weapon systems. To assure the ultimate in solderable surfaces it was felt that gold plating should be used. However, as printed wiring boards got into production, various puzzling defects entered the picture.

Author Information

Keller, J., D.
Martin Co., Orlando, Fla.
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Developed by Committee: B02
Pages: 3–12
DOI: 10.1520/STP45805S
ISBN-EB: 978-0-8031-6721-6
ISBN-13: 978-0-8031-6597-7