SYMPOSIA PAPER Published: 01 January 2007
STP45325S

Thermal Residual Stress Relaxation in Powder Metal IN100 Superalloy

Source

Relaxation of shot peen induced compressive residual stresses due to thermal exposure was measured using X-ray diffraction. The material used in this study was a hot isostatically pressed (HIP) powder metal (PM) IN100 nickel base superalloy. A total of 14 IN100 samples were shot peened to an Almen intensity of 6A using MI-170-R shot with 125 % coverage. The sample dimensions were nominally 16×13×4-mm thick with an irradiated X-ray region of 8×5 mm. Residual stress measurements were made at the surface and at nominal depths of 12, 25, 50, 75, 125, 175, 250, and 350 microns. The shot peened samples were thermal exposed at two temperatures (650, 704°C) and a range of exposure times (0.5–300 h). Residual stress measurements on shot peened samples without thermal exposure were used as a basis for comparison. The relaxation of shot peened compressive residual stresses under purely thermal loading was examined. The residual stresses exhibited an initial rapid decrease on the surface and in the depth at both temperatures. However, continued thermal exposure produced little or no change in surface residual stresses while peak compressive stresses in the depth continued to relax with time at both temperatures. In all cases of this study the retained peak compressive residual stress after thermal exposure was greater than 50 % of the baseline value.

Author Information

Buchanan, Dennis, J.
University of Dayton Research Institute, Dayton, Ohio
John, Reji
Air Force Research Laboratory, Materials and Manufacturing Directorate, AFRL/MLLMN, Wright-Patterson Air Force Base, Ohio
Ashbaugh, Noel, E.
University of Dayton Research Institute, Dayton, Ohio
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Details
Developed by Committee: E08
Pages: 47–57
DOI: 10.1520/STP45325S
ISBN-EB: 978-0-8031-6238-9
ISBN-13: 978-0-8031-4472-9