SYMPOSIA PAPER Published: 01 January 1964

Flexural Moduli and Deflection Temperatures of Various Epoxy Formulations


Epoxy resins are continually being modified in order to achieve improved performance and processing. The effects on flexural modulus and deflection temperatures are studied for a system with an alumina filler and for one without an alumina filler at varying concentrations of the curing agent. In addition flexural moduli for seven flexibilized systems are studied at temperatures from −54 to +74C.

Author Information

DeLollis, N., J.
Materials Laboratory Div., Sandia Corp., Albuquerque, N. Mex.
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Developed by Committee: D14
Pages: 81–86
DOI: 10.1520/STP44565S
ISBN-EB: 978-0-8031-5998-3
ISBN-13: 978-0-8031-6152-8