SYMPOSIA PAPER Published: 01 January 1986

Solder Bloom Corrosion Analysis Based on Field Survey Data, Potential Causes, and Resolution


A method to analyze field survey data on the solder bloom corrosion in copper/brass radiators is presented. In an effort to distinguish various manufacturers' radiator products according to their solder bloom corrosion performance, a corrosion index number is introduced (Park's Solder Bloom Corrosion Index). Using this technique, the solder bloom corrosion susceptibility of various manufacturers' radiators can be forceranked as a function of miles-in-service and months-in-service.

Potential causes for the solder bloom corrosion in the copper/brass radiators are analyzed from the standpoint of coolant type used, solder type used, different soldering processes, various internal rinse systems, and so forth. Based on the data analysis, a number of recommendations are presented for the potential resolution of solder bloom corrosion.

Author Information

Park, KH
Product Engineering Office, Climate Control Division, Ford Motor Co., Dearborn, MI
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Developed by Committee: D15
Pages: 123–143
DOI: 10.1520/STP32978S
ISBN-EB: 978-0-8031-4959-5
ISBN-13: 978-0-8031-0432-7