SYMPOSIA PAPER Published: 01 January 1988

Packing to Reduce Electrostatic Discharge Damage and Related Testing


The protection of electronic components from electrostatic discharge (ESD) is a prime concern at RCA. To establish and support an effective antistatic packing program, various materials were tested and testing methods evaluated. This paper presents the data compiled over two years of application of the static decay and triboelectric testing methods. The data demonstrates that a topically coated PVC tube, in a foil-lined sleeve, is a cost-effective, state-of-the-art method of packing semiconductor devices.

Author Information

Murello, AF
RCA, Somerville, NJ
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Developed by Committee: D10
Pages: 10–23
DOI: 10.1520/STP26370S
ISBN-EB: 978-0-8031-5062-1
ISBN-13: 978-0-8031-1171-4