SYMPOSIA PAPER Published: 01 January 1990

Role of the Oxide Film in the Transgranular Stress Corrosion Cracking of Copper


Cyclic voltammetry, ellipsometry, and slow strain rate tests have been carried out on copper monocrystals in 0.1 M sodium acetate and 1 M sodium nitrite. These studies demonstrate that the presence of an oxide film is necessary but not sufficient to induce transgranular stress corrosion cracking, and that the growth rate and other characteristics of the oxide(s) are important factors. The results are discussed in terms of the film-induced cleavage model for cracking.

Author Information

Cassagne, TB
UNIREC, Friminy, MD, France
Kruger, J
The Johns Hopkins University, Baltimore, MD
Pugh, EN
National Bureau of Standards, Gaithersburg, MD
Price: $25.00
Contact Sales
Reprints and Permissions
Reprints and copyright permissions can be requested through the
Copyright Clearance Center
Developed by Committee: G01
Pages: 59–75
DOI: 10.1520/STP24061S
ISBN-EB: 978-0-8031-5114-7
ISBN-13: 978-0-8031-1276-6