SYMPOSIA PAPER Published: 01 January 1991

In-Plane and Out-of-Plane Coefficient of Thermal Expansion Characterization of New High-Performance Printed Circuit Boards Using Dilatometer and Thermomechanical Analysis


This paper provides both in-plane and out-of-plane coefficient of thermal expansions (CTEs) of a high-performance QUATREX 5010 epoxy/Kevlar-120 fabric composite printed circuit board (PCB). Although both a quartz push-rod dilatometer and a thermomechanical analyzer (TMA) were used to measure the in-plane CTEs, the results indicate that the dilatometer is a better choice for accurate, precise determinations, especially for Kevlar/epoxy composites that had a CTE of 3.5 ppm/°C in the x and y direction. Based on our past experience testing various composite PCB materials based on E-glass, quartz, and Kevlar reinforcements, epoxy, polyimide, BT/epoxy, cyanate ester, and so forth, we recommend the dilatometer for accurately measuring the in-plane CTEs of Kevlar- and quartz-reinforced PCBs, which generally are below 9 ppm/°C. The TMA method, which is a faster and easier method than the dilatometer method, can be used reliably for accurately measuring the in-plane CTEs of E-glass-reinforced PCBs, which generally range from 12 to 16 ppm/°C.

Author Information

Ibrahim, AM
Martin Marietta Laboratories, Baltimore, MD
Klemens, ML
Martin Marietta Laboratories, Baltimore, MD
Cozzo, TF
Martin Marietta Laboratories, Baltimore, MD
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Developed by Committee: E37
Pages: 161–167
DOI: 10.1520/STP23600S
ISBN-EB: 978-0-8031-5178-9
ISBN-13: 978-0-8031-1434-0