SYMPOSIA PAPER Published: 26 February 2022

Fabrication of Complex Geometries of High-Purity Copper with Superior Thermal Performance


This technical paper outlines a digital light processing (DLP) technique that can produce geometrically complex, highly conductive, pure copper parts. By incorporating a high-purity, high-sphericity copper powder into the DLP feedstock and optimizing the DLP printing and sintering process parameters, parts made with this technique achieve electrical conductivities greater than 92% (International Annealed Copper Standard) and negative and positive feature sizes down to 100 µm. As demonstrated by computational fluid dynamics modeling, the resulting copper cold plates exhibit superior thermal performance with an additional 4°C of cooling compared to traditionally manufactured cold plates.

Author Information

Synnestvedt, Sarah
Holo Inc., Newark, CA, US
Harry, Katherine
Holo Inc., Newark, CA, US
Bodla, Karthik
Holo Inc., Newark, CA, US
Pelletier, Etienne
5N Plus Inc., Montreal, Quebec, CA
Bouchemit, Arslane
5N Plus Inc., Montreal, Quebec, CA
Nobari, Amir
5N Plus Inc., Montreal, Quebec, CA
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Pages: 131–151
DOI: 10.1520/STP163720200122
ISBN-EB: 978-0-8031-7722-2
ISBN-13: 978-0-8031-7721-5