STP Published: 2011

Lead-free Solders

Editor(s): K. Narayan Prabhu

Eleven peer-reviewed papers address the environmental and health concerns related to the exposure to lead during soldering and the success and failures of lead-free solders. Topics cover:
• Factors affecting the wetting behavior of solders and evolution of interfacial microstructure
• Pb-free high temperature solders for power semiconductor devices
• Effect of surface roughness on wetting behavior and evolution of microstructure of two lead free solders on copper substrates
• Fatigue life of SnBi Finished thin-small-outline-package (TSOP) parts under thermal cycling
• Microstructural aspects of the ductile-to-brittle transition
• Loading mixity on the interfacial failure mode in lead-free solder joint
• Solder joint strengths of BGA (Ball Grid Array) lead-free to that of eutectic lead (Sn-Pb) solder joint strengths.
• Effect of the morphology of Cu6Sn5 intermetallic compound on tensile properties of bulk solder and solder joint
• Tensile properties of Sn-10Sb-5Cu high temperature lead free solder
• Empirical modeling and rheological characterization of solder pastes used in electronic assemblies

STP 1530 is a valuable resource for students, researchers, and material scientists in the electronic industry.

Table of Contents

Girish Kumar, K. Narayan Prabhu

Y. Takaku, I. Ohnuma, Y. Yamada, Y. Yagi, I. Nakagawa, T. Atsumi, M. Shirai, K. Ishida

Konstantina Lambrinou, Werner Engelmaier

Feng Gao, Jianping Jing, Frank Z. Liang, Richard L. Williams, Jianmin Qu

Qiulian Zeng, Jianjun Guo, Xiaolong Gu, Qingsheng Zhu, Xiaogang Liu

John H. Currier, Michael B. Mayor, John P. Collier, Barbara H. Currier, Douglas W. Van Citters

P. J. Ellison, A. Traynor, B. P. Casey, S. N. Collins

Hani Haider, Christian Kaddick

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Developed by Committee: D02
Pages: 217
DOI: 10.1520/STP1530-EB
ISBN-EB: 978-0-8031-8683-5
ISBN-13: 978-0-8031-7516-7