SYMPOSIA PAPER Published: 01 January 1995

A New Technique to Produce Josephson Junctions Based on Controlled Crack Growth Techniques


The ability to introduce microcracks by placing multiple microindentations in pre-defined locations in a single crystal substrate opens the possibility for the use of microindentation techniques for electronic device fabrication. It is the objective of this study to demonstrate the possibility of fabricating a superconducting Josephson junction (JJ) by using microindentation cracking techniques. Other potential areas where microindentation techniques can be applied for device fabrication are RF microcircuitry and fiber optics. Once a microindentation is produced, with its associated crack pattern, a means of growing the cracks is required. In this study we present three methods of crack growth, a bending moment method, a thermal stressing method and a crack tip to tip bridging method. Results of these methods applied to single crystal MgO and LaAlO3 are discussed.

Author Information

Perez, I
Naval Air Warfare Center, Warminster, PA
Granata, D
Naval Air Warfare Center, Warminster, PA
Scott, WR
Naval Air Warfare Center, Warminster, PA
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Developed by Committee: E08
Pages: 255–267
DOI: 10.1520/STP14597S
ISBN-EB: 978-0-8031-5294-6
ISBN-13: 978-0-8031-1882-9