SYMPOSIA PAPER Published: 01 January 1995
STP14594S

Bimaterial Problem of Strip with Debondings under Tension and Bending

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A bimaterial problem is considered for partially bonded strips which are symmetrical with respect to a straight interface. The strips have debondings at both sides of the interface. The geometry of the strip is one of the test specimen. The debonding is the failure at the interface. A rational mapping function and complex stress functions are used for the analysis. Tensile forces and couples apply at the ends of each strip. Stress distributions are shown graphically. Stress Intensity of Debonding is defined and is used to evaluate the strength of debonding. The effect of debonding lengths, material constants, and loading conditions on the stress intensity of debonding is investigated. The development of debonding is also investigated.

Author Information

Hasebe, N
Nagoya Institute of Technology, Nagoya, Japan
Kato, S
Chubu Electric Power Company, Nagoya, Japan
Nakamura, T
Nagoya Institute of Technology, Nagoya, Japan
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Details
Developed by Committee: E08
Pages: 206–221
DOI: 10.1520/STP14594S
ISBN-EB: 978-0-8031-5294-6
ISBN-13: 978-0-8031-1882-9