SYMPOSIA PAPER Published: 01 January 1999

Mixed-Mode Fracture Behavior of Silica Particulate Filled Epoxide Resin


Silica particulate filled epoxide resins are used as encapsulant materials in semiconductor packaging. In the present paper, fracture behavior of the epoxide resin, containing 70 wt% silica particles, have been studied at room temperature and high temperature, that is, 250°C. The three-point and four-point bending tests were performed to obtain Mode I and mixed-mode fracture toughness, respectively. The specimen fractured in a brittle manner under room temperature conditions, and the results obeyed the maximum hoop stress criterion. On the other hand, the results at high temperature showed a relatively low dependency on Mode II stress intensity factors. Fracture surface were observed in a scanning laser microscope. Finite element analysis, taking into account the microstructure of the material, have been conducted in order to investigate the influence of temperature on mixed-mode fracture behavior. Local fracture criteria were considered for the silica particles and the epoxide resin. The material constants in criteria were estimated from the bending strength and the Mode I fracture toughness of the material. Good agreement between experimental and numerical results was obtained for the fracture boundary curves on the Mode I and Mode II stress intensity diagram.

Author Information

Kishimoto, K
Tokyo Institute of Technology, Tokyo, Japan
Notomi, M
Meiji University, Kawasaki, Japan
Kadota, S
Tokyo Institute of Technology, Tokyo, Japan
Shibuya, T
Tokyo Institute of Technology, Tokyo, Japan
Kawamura, N
Research and Development Center, Toshiba Corporation, Kawasaki, Japan
Kawakami, T
Research and Development Center, Toshiba Corporation, Kawasaki, Japan
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Developed by Committee: E08
Pages: 129–142
DOI: 10.1520/STP14247S
ISBN-EB: 978-0-8031-5406-3
ISBN-13: 978-0-8031-2602-2