SYMPOSIA PAPER Published: 01 January 1994

Predicting Creep Behavior of Silicon Nitride Components Using Finite Element Techniques


The creep of silicon nitride tensile specimens has been modeled and incorporated into finite element software to predict the behavior of structural components. The experimental results are for the creep deformation of HIP'ed, yttria-doped silicon nitride at temperatures up to 1400°C. Results are for both homogeneous and joined specimens. This experimental data base was modeled using two approaches: Arrhenius law representation of the steady state phase, and theta projection method representation of both primary and secondary stages. The Arrhenius law has been incorporated into commercial finite element software and used to predict the creep deformation behavior and time to failure for a simulated component represented by a notched tensile specimen.

Author Information

Wade, JA
Saint-Gobain/Norton Industrial Ceramics Corporation, Northboro, MA
White, CS
Saint-Gobain/Norton Industrial Ceramics Corporation, Northboro, MA
Wu, FJ
Saint-Gobain/Norton Industrial Ceramics Corporation, currently PDA Engineering, Burlington, MA
Price: $25.00
Contact Sales
Reprints and Permissions
Reprints and copyright permissions can be requested through the
Copyright Clearance Center
Developed by Committee: C28
Pages: 360–372
DOI: 10.1520/STP12793S
ISBN-EB: 978-0-8031-5268-7
ISBN-13: 978-0-8031-1864-5