STP Published: 1994

Fatigue of Electronic Materials

Editor(s): Scott A. Schroeder, M. R. Mitchell

Information from fatigue practitioners active in the microelectronics area that assess the current state and direction of fatigue/reliability research. 9 peer-reviewed papers provide:

• Valuable insight into the various methods in use to characterize the fatigue/creep interactions within solder under typical temperature and loading ranges of electronic systems

• Details on the complexity of fatigue/reliability testing of electronic component systems

• An excellent overview of the inherent complexities in accelerated fatigue testing of materials subject to high homologous temperatures and continual microstructural changes

• Examples of fatigue and creep characterization applied to reliability assessments of actual electronic components.

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Developed by Committee: E08
Pages: 150
DOI: 10.1520/STP1153-EB
ISBN-EB: 978-0-8031-5260-1
ISBN-13: 978-0-8031-1994-9