SYMPOSIA PAPER Published: 01 January 2002

A Round Robin Interlaboratory Comparison of Thermal Conductivity Testing Using the Guarded Hot Plate up to 1000°C


A round robin interlaboratory comparison of thermal conductivity measurements was performed using the Guarded Hot Plate apparatus at temperatures from about 0°C to 1000 °C. There were twelve participating laboratories including four national laboratories in three different countries. A statistical analysis was performed and the variation in measurement results is discussed. Both within laboratory and between laboratory variability is analyzed. A definite conclusion of this comparison is that measurement variation increases progressively with increasing temperature. As a result there is a need for the U.S. national laboratory, the National Institute of Standards & Technology, to develop high temperature testing capability and then high temperature thermal conductivity reference standards.

Author Information

Albers, MA
Johns Manville Technical Center, Littleton, CO
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Developed by Committee: C16
Pages: 116–130
DOI: 10.1520/STP11008S
ISBN-EB: 978-0-8031-5469-8
ISBN-13: 978-0-8031-2898-9