SYMPOSIA PAPER Published: 01 January 2001

Analysis of Curing Using Simultaneous Dynamic Mechanical and Dielectric Measurements


Previously, curing reaction of a thermosetting system, with one of the components being a volatile material, was studied using Simultaneous Thermal Analyzer (STA). The actual heat of curing can be determined by subtracting the heat of volatilization from the heat of the curing process.

A new study of a similar thermosetting system using simultaneous dynamic mechanical and dielectric measurements will compare the onset and completion of the curing reaction between the two measurements. In addition, the new study will also compare between rheological properties such as dynamic loss modulus, G”, and dynamic viscosity, ETA*, and dielectric property such as dynamic loss parameter, ε”.

Author Information

Suwardie, JH
Rheometric Scientific, Inc., Piscataway, NJ, USA
Price: $25.00
Contact Sales
Reprints and Permissions
Reprints and copyright permissions can be requested through the
Copyright Clearance Center
Developed by Committee: E37
Pages: 131–138
DOI: 10.1520/STP10705S
ISBN-EB: 978-0-8031-5452-0
ISBN-13: 978-0-8031-2887-3