Journal Published Online: 26 March 2014
Volume 3, Issue 3

A Multiscale Framework for Predicting Fracture Toughness of Polycrystalline Metals

CODEN: MPCACD

Abstract

Microstructure has a strong influence on fracture toughness of materials through the activation of different fracture mechanisms. To tailor the fracture resistance through microstructure design, it is important to establish relations between microstructure and fracture toughness. A multiscale computational framework based on the Cohesive Finite Element Method (CFEM) is introduced to facilitate relations between microstructure and the fracture toughness of ductile polycrystalline materials. This material design framework includes 3D image based microstructure reconstruction, 3D meshing, and finite element implementation. It allows the material fracture toughness to be predicted through explicit simulation of fracture processes involving arbitrary crack paths, crack tip microcracking, and branching. Cohesive elements are embedded both within the grains and along the grain boundaries to resolve the different material separation processes. The calculations carried out concern Ti-6Al-4V alloy and focused on the two primary fracture mechanisms which are correlated with microstructure characteristics, constituent properties, and deformation behaviors. The methodology is potentially useful for both the selection of materials and tailoring of microstructure to improve fracture resistance.

Author Information

Li, Yan
The George W. Woodruff School of Mechanical Engineering School of Material Science and Engineering, Georgia Institute of Technology, Atlanta, GA, US
McDowell, D.
The George W. Woodruff School of Mechanical Engineering School of Material Science and Engineering, Georgia Institute of Technology, Atlanta, GA, US
Zhou, Min
The George W. Woodruff School of Mechanical Engineering School of Material Science and Engineering, Georgia Institute of Technology, Atlanta, GA, US
Pages: 16
Price: $25.00
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Details
Stock #: MPC20130064
ISSN: 2165-3992
DOI: 10.1520/MPC20130064