JavaScript seems to be disabled in your browser. For the best experience on our site, be sure to turn on Javascript in your browser.
Get Involved
F0390 Standard Test Method for Sheet Resistance of Thin Metallic Films With a Collinear Four-Probe Array (Withdrawn 2020)
F390-11 Standard Test Method for Sheet Resistance of Thin Metallic Films With a Collinear Four-Probe Array (Withdrawn 2020)
F1238 Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications (Withdrawn 2020)
F1238-95(2011) Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications (Withdrawn 2020)
F1367 Standard Specification for Chromium Sputtering Targets for Thin Film Applications (Withdrawn 2020)
F1367-98(2011) Standard Specification for Chromium Sputtering Targets for Thin Film Applications (Withdrawn 2020)
F1512 Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies (Withdrawn 2020)
F1512-94(2011) Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies (Withdrawn 2020)
F1513 Standard Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications (Withdrawn 2020)
F1513-99(2011) Standard Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications (Withdrawn 2020)
F1593-08(2016) Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum by High Mass-Resolution Glow-Discharge Mass Spectrometer (Withdrawn 2023)
F1594 Standard Specification for Pure Aluminum (Unalloyed) Source Material for Vacuum Coating Applications (Withdrawn 2020)
F1594-95(2011) Standard Specification for Pure Aluminum (Unalloyed) Source Material for Vacuum Coating Applications (Withdrawn 2020)
F1709-97(2016) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications (Withdrawn 2023)
F1710-08(2016) Standard Test Method for Trace Metallic Impurities in Electronic Grade Titanium by High Mass-Resolution Glow Discharge Mass Spectrometer (Withdrawn 2023)
F1711-96(2016) Standard Practice for Measuring Sheet Resistance of Thin Film Conductors for Flat Panel Display Manufacturing Using a Four-Point Probe Method (Withdrawn 2023)
F1761 Standard Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets (Withdrawn 2020)
F1761-00(2011) Standard Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets (Withdrawn 2020)
F1844-97(2016) Standard Practice for Measuring Sheet Resistance of Thin Film Conductors For Flat Panel Display Manufacturing Using a Noncontact Eddy Current Gage (Withdrawn 2023)
F1845-08(2016) Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum-Copper, Aluminum-Silicon, and Aluminum-Copper-Silicon Alloys by High-Mass-Resolution Glow Discharge Mass Spectrometer (Withdrawn 2023)
F1894 Test Method for Quantifying Tungsten Silicide Semiconductor Process Films for Composition and Thickness (Withdrawn 2020)
F1894-98(2011) Test Method for Quantifying Tungsten Silicide Semiconductor Process Films for Composition and Thickness (Withdrawn 2020)
F2086-01 Standard Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets, Method 2 (Withdrawn 2007)
F2113 Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications (Withdrawn 2020)
F2113-01(2011) Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications (Withdrawn 2020)
F2405 Standard Test Method for Trace Metallic Impurities in High Purity Copper by High-Mass-Resolution Glow Discharge Mass Spectrometer (Withdrawn 2020)
F2405-04(2011) Standard Test Method for Trace Metallic Impurities in High Purity Copper by High-Mass-Resolution Glow Discharge Mass Spectrometer (Withdrawn 2020)
F3166-16 Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization (Withdrawn 2023)
F3192-16 Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization (Withdrawn 2023)
