Journal Published Online: 21 August 2015
Volume 44, Issue 4

Degradation Behavior of BaTiO Dielectrics for MLCCs by an Accelerated Life Test With Voltage and Temperature Stress Factors

CODEN: JTEVAB

Abstract

An accelerated life test (ALT) was designed under voltage and temperature stresses using 1005 type multilayer ceramic capacitors (MLCCs) based Ni-BaTiO3, and failure analysis was also conducted to compare the individual stress. The inverse power and Arrhenius models were applied to the voltage and temperature accelerated tests, respectively, and times to failure (TTF) of MLCCs under individual stress were measured. The stress–life relation was plotted from obtained life data, and characteristic life (B63.5) was calculated at the same condition of 130°C and 3 times rated voltage. B63.5 under the voltage stress was 15.91 min and that of the temperature stress was 17.23 min. It was determined that the voltage stress had more influence on the degradation of insulation resistance for MLCCs. As a result of an analysis of the chemical bonding state from the dielectric ceramic and inner electrodes, according to increase in the stresses, the binding energy of Ti 2p3/2 and Ni 2p3/2 peak changed, which generated oxygen vacancies. These oxygen vacancies accelerated the degradation under the high-voltage stress, caused the reduction of the BaTiO3 ceramic and oxidation of the Ni electrode, and consequently decreased the insulation resistance.

Author Information

Kim, Juyoung
School of Materials Science and Engineering, Pusan National Univ., Busan, KR
Lee, Seung-Hwan
Research and Development Center, Samwha Capacitor Co., Ltd., Yongin, KR
Yoon, Jung-Rag
Research and Development Center, Samwha Capacitor Co., Ltd., Yongin, KR
Van Tyne, Chester
Dept. of Metallurgical and Materials Engineering, Colorado School of Mines, Golden, CO, US
Ohk, Ki-Yool
Dept. of Business Administration, Pusan National Univ., Busan, KR
Lee, Heesoo
School of Materials Science and Engineering, Pusan National Univ., Busan, KR
Pages: 7
Price: $25.00
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Stock #: JTE20140522
ISSN: 0090-3973
DOI: 10.1520/JTE20140522