Journal Published Online: 01 November 1986
Volume 14, Issue 6

A Computerized Test System for Thermal-Mechanical Fatigue Crack Growth



A computerized testing system to measure fatigue crack growth under thermal-mechanical fatigue conditions is described. Built around a servohydraulic machine, the system is capable of a push-pull test under stress- or strain-controlled conditions in the temperature range of 25 to 1050°C. Temperature and mechanical strain are independently controlled by the closed-loop system to simulate complex inservice strain-temperature relationship.

A d-c electrical potential method is used to measure crack growth rates. The correction procedure of the potential signal to take into account powerline and RF-induced noises and thermal changes is described. It is shown that the potential drop technique can be used for physical mechanism studies and for modelling crack tip processes.

Author Information

Marchand, N
Massachusetts Institute of Technology, Cambridge, MA
Pelloux, RM
Massachusetts Institute of Technology, Cambridge, MA
Pages: 9
Price: $25.00
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Stock #: JTE10347J
ISSN: 0090-3973
DOI: 10.1520/JTE10347J