Journal Published Online: 03 December 2009
Volume 38, Issue 2

Capability Testing Based on Subsamples: A Case on Photolithography Process Control in Wafer Fabrication



Photolithography is considered as the bottleneck in semiconductor manufacturing, and a good control of critical dimension, alignment accuracy, and photoresist thickness is essential for maintaining a high quality level of wafers. In this study, a photolithography process in a semiconductor factory is investigated, and the process performance of critical dimension, alignment accuracy, and photoresist thickness measurement is tested based on the process capability index CPMK. Critical values required for hypothesis testing are obtained based on subsamples. This investigation is useful to practitioners in making reliable decision in capability determination. By applying our research results to analyze the process performance with the three critical parameters, a production department can trace and improve the photolithography process.

Author Information

Liao, Mou-Yuan
Dept. of Finance, Yuanpei Univ., HsinChu, Taiwan, Republic of China
Kang, He-Yau
Dept. of Industrial Engineering and Management, National Chin-Yi Univ. of Technology, Taiping City, Taichung Country 411 Taiwan, Republic of China
Lee, Amy
Dept. of Industrial Management, Chung Hua Univ., Hsinchu, Taiwan, Republic of China
Wu, Chien-Wei
Dept. of Industrial Engineering and Systems Management, Feng Chia Univ., Seatwen, Taichung, Taiwan, Republic of China
Pages: 10
Price: $25.00
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Stock #: JTE102388
ISSN: 0090-3973
DOI: 10.1520/JTE102388