Journal Published Online: 01 July 1973
Volume 1, Issue 4

Measurements in Silicon Planar Technology: Mechanical Properties of Semiconductor Surfaces



Methods for growing silicon single crystals and then fabricating them into polished wafer form are reviewed. A survey of many of the parameters and measurement techniques needed to specify the polished surface is included. The activities of the Section on the Mechanical Properties of Semiconductor Surfaces are discussed.

Author Information

Mendel, E
IBM System Products Division, East Fishkill, Hopewell Junction, New York
Pages: 5
Price: $25.00
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Stock #: JTE10023J
ISSN: 0090-3973
DOI: 10.1520/JTE10023J