F01.03 Jurisdiction Page

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Subcommittee F01.03 on Metallic Materials, Wire Bonding, and Flip Chip

Matching Standards Under the Jurisdiction of F01.03 by Status

Active 17 matching standards

F15-04(2022) Standard Specification for Iron-Nickel-Cobalt Sealing Alloy
F29-97(2022) Standard Specification for Dumet Wire for Glass-to-Metal Seal Applications
F30-96(2017) Standard Specification for Iron-Nickel Sealing Alloys
F31-21 Standard Specification for Nickel-Chromium-Iron Sealing Alloys
F72-21 Standard Specification for Gold Wire for Semiconductor Lead Bonding
F73-96(2017) Standard Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps
F96-77(2020) Standard Specification for Electronic Grade Alloys of Copper and Nickel in Wrought Forms
F106-12(2017) Standard Specification for Brazing Filler Metals for Electron Devices
F204-76(2018) Standard Test Method for Surface Flaws in Tungsten Seal Rod and Wire
F269-60(2019) Standard Test Method for Sag of Tungsten Wire
F288-96(2019) Standard Specification for Tungsten Wire for Electron Devices and Lamps
F289-96(2019) Standard Specification for Molybdenum Wire and Rod for Electronic Applications
F290-94(2020) Standard Specification for Round Wire for Winding Electron Tube Grid Laterals
F364-96(2019) Standard Specification for Molybdenum Flattened Wire for Electron Tubes
F487-13(2018) Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding
F1466-20 Standard Specification for Iron-Nickel-Cobalt Alloys for Metal-to-Ceramic Sealing Applications
F1684-06(2021) Standard Specification for Iron-Nickel and Iron-Nickel-Cobalt Alloys for Low Thermal Expansion Applications

Withdrawn, Replaced 30 matching standards

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