Significance and Use
4.1 The elevated temperature and moisture conditioning procedures prescribed in this practice are designed to provide a standard procedure to be used to evaluate and compare the effect of elevated temperature and moisture conditioning under controlled laboratory conditions on pultruded FRP composites to be used in structural design applications. The conditioning procedures prescribed in this practice are designed to obtain reproducible results to compare and evaluate these materials but are not intended to produce equilibrium conditions or actual service conditions for these materials.
1.1 In general, it is feasible that the mechanical properties of FRP composites will be affected by environmental conditions such as exposure to moisture at elevated temperatures. In order to make reliable comparisons between different materials under elevated temperature and moisture environmental conditions, it is necessary to standardize the elevated temperature and moisture conditions to which specimens of these materials are subjected prior to and during testing. This practice defines procedures for elevated temperature and moisture conditioning of pultruded FRP composites intended for use in structural design applications. The conditioning medium representing elevated temperature and moisture exposure described in this standard practice is distilled water maintained at 37.8 ± 1.5°C (100 ± 3°F) for 1000 hours.
1.2 Units—The values stated in either SI units or inch-pound units are to be regarded separately as standard. The values stated in each system may not be exact equivalents; therefore, each system shall be used independently of the other. Combining values from the two systems may result in nonconformance with the standard.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.