Journal Published Online: 01 January 2001
Volume 23, Issue 1

Effect of Environment on Fracture Toughness and Debond Growth of Aluminum/FM 73/Boron-Epoxy Adhesively Bonded Joints



Tests were conducted to determine the fracture toughness of aluminum/FM®73/boron-epoxy adhesively bonded joints. Double cantilever beam (DCB) specimens and end-notched flexure (ENF) specimens were exposed to one of the following environments: hot/wet (71° C(160° F) and >90% RH) conditions for 5000 h, thermal cycles between 71° C (160° F) and −54° C (−65° F), or an outdoor “rooftop” environment for 10 000 h. The environmentally exposed specimens were tested along with as-received (or unexposed specimens). The different adherend materials had different coefficients of thermal expansion (CTE). The mismatch of CTE between adherends caused residual thermal stresses in the adhesive joints at every temperature other than the elevated cure temperature. The residual stresses could not be accounted for with closed form solutions. Finite element analysis (FEA) of the specimens was required. Using FEA solutions, it was determined that the fracture toughness of the environmentally exposed specimens was lower than the as-received specimens for every environment tested for both DCB and ENF specimens.

Author Information

Lubke, KA
Ford Corporation
Butkus, LM
Major in USAF at Wright Patterson AFB, OH
Johnson, WS
Georgia Institute of Technology, Atlanta, GA
Pages: 8
Price: $25.00
Reprints and Permissions
Reprints and copyright permissions can be requested through the
Copyright Clearance Center
Stock #: CTR10912J
ISSN: 0884-6804
DOI: 10.1520/CTR10912J