Standard Historical Last Updated: Dec 31, 2010 Track Document
ASTM C557-03e1

Standard Specification for Adhesives for Fastening Gypsum Wallboard to Wood Framing

Standard Specification for Adhesives for Fastening Gypsum Wallboard to Wood Framing C0557-03E01 ASTM|C0557-03E01|en-US Standard Specification for Adhesives for Fastening Gypsum Wallboard to Wood Framing Standard new BOS Vol. 15.06 Committee D14
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Abstract

This specification covers the minimum performance standards for and properties of adhesives intended to bond the back surface paper of gypsum wallboard to wood framing members. Test requirements and test methods for the adhesive used for the application of all thicknesses of gypsum wallboard are also covered. The specification provides a basis for ensuring the quality of adhesives. Compression shear test, tensile test, gap filling or bridging characteristics test, freeze-thaw stability test, and accelerated adhesive aging shall be performed on the adhesive. The tests are suitable for products performance certification and quality control programs and can be useful the general public, adhesive manufacturers, distributors, specifiers, architects, contractors, testing laboratories and other businesses and professionals.

Scope

1.1 This specification includes properties and covers minimum performance standards for adhesives intended to bond the back surface paper of gypsum wallboard to wood framing members.

1.2 The values stated in inch-pound units are to be regarded as the standard. The SI units given in parentheses are for information only.

1.3 This specification also covers test requirements and test methods for the adhesive used for the application of all thicknesses of gypsum wallboard.

This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

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Details
Book of Standards Volume: 15.06
Developed by Subcommittee: D14.70
Pages: 9
DOI: 10.1520/C0557-03E01