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    ASTM F1227-89(1999)

    Test Method for Total Mass Loss of Materials and Condensation of Outgassed Volatiles on Microelectronics-Related Substrates (Withdrawn 2000)

    Withdrawn Standard: ASTM F1227-89(1999) | Developed by Subcommittee: E21.05

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    1. Scope

    1.1 This test method covers various thermoplastics and thermosets routinely used in the microelectronics industry. This test method covers a screening technique to determine volatile content of these materials when exposed to a vacuum environment. Two parameters are measured: total mass loss (TML) and collected volatile condensable materials (CVCM).

    1.2 This test method describes the test apparatus and related operating procedures for evaluating the mass loss of materials being subjected to 25°, 70° or 125°C at less than 5 Pa (0.05 mbars) for 24 h. The lowest temperature simulates storage conditions, while the middle and upper temperatures simulate soft bake and hard bake conditions encountered during microelectronics manufacturing. The overall mass loss can be classified into noncondensables and condensables. The latter are characterized herein as being capable of condensing on a silicon wafer, glass plate, aluminum disk or other substrate, maintained at a temperature of 18°C.

    Note 1-Unless otherwise noted, the tolerances are 18°C + 3°C, 25°C + 1°C, 70°C + 1°C, and 125°C + 1°C.

    1.3 Any thermoplastic or thermoset can be tested. The materials may be tested in the "as-received" condition or prepared for test after various curing or manufacturing steps.

    1.4 This test method is primarily a screening technique for materials and is not necessarily valid for computing actual contamination on a system or component because of possible differences in configuration, temperatures, and material processing. The three temperatures allow testing with respect to maximum expected service temperature. Also, many polymers cannot be tested at 125°C as they melt or undergo glass transition above 70°C.

    1.5 The use of materials that are deemed acceptable in accordance with this test method does not ensure that the system or component will remain uncontaminated. Therefore, subsequent functional, developmental, and qualification tests should be used, as necessary, to ensure that material performance is satisfactory.

    1.6 No data is yet available to evaluate minimum sample sizes. Sample sizes as small as 130 mg have been used.

    1.7 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.

    1.8 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

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    DOI: 10.1520/F1227-89R99

    Citation Format

    ASTM F1227-89(1999), Test Method for Total Mass Loss of Materials and Condensation of Outgassed Volatiles on Microelectronics-Related Substrates (Withdrawn 2000), ASTM International, West Conshohocken, PA, 1999,

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