Dates: Wednesday October 28 2020 - Thursday October 29 2020
Location: Renaissance Orlando at SeaWorld Orlando, FL
Sponsored by: C16 Thermal Insulation
Deadline for Abstract Submittal: Friday June 07 2019
Papers are invited for a Symposium on Performance, Properties and Resiliency of Thermal Insulations to be held Wednesday and Thursday, October 28 & 29, 2020. Sponsored by ASTM Committees C16 on Thermal Insulation and E06 on Performance of Buildings, this symposium will be held at the Renaissance Orlando at SeaWorld in Orlando, FL, in conjunction with the October standards development meetings of the committee.
The objective of this symposium is to present and discuss current research on physical and chemical properties of thermal insulation materials and assemblies, with special attention to resiliency and durability.
Possible topics include:
The language of the symposium will be English.
To participate in the symposium, authors must submit a 300-word preliminary abstract using the online Abstract Submittal Form no later than June 7, 2019. To ensure your abstract was received into the ASTM database, please email firstname.lastname@example.org to inform us that you have submitted an abstract.The abstract must include a clear definition of the objective and approach of the work discussed, pointing out material that is new, and present sufficient details regarding results. The presentation and manuscript must not be of a commercial nature nor can it have been previously published. Because a limited number of abstracts will be accepted, be sure that the abstract is complete to allow for careful assessment of the paper's suitability for this symposium. Symposium Chairman Diana Fisler and Co-chair Marcin Pazera will notify you via email and postal mail by July 5, 2019 of your paper’s acceptability for presentation at the symposium. If the preliminary abstract is accepted, the presenter/author will be requested to submit a final, camera-ready, abstract several months before the symposium. The final abstracts will be distributed in an abstract booklet at the symposium.
Symposium presenters are required to submit their papers to the Selected Technical Papers (STP), an online and printed, peer-reviewed publication for the international scientific and engineering community. After the final selection of abstracts has been approved, the ASTM Editorial Office will send authors’ instructions via email only. Manuscripts to be peer reviewed for the STP are due online no later than January 17, 2020 at the ASTM Editorial Office. The corresponding author (the author who is the main contact with ASTM Headquarters) will receive a copy of their paper in portable document format (.pdf). All published authors will have the opportunity to purchase reprints of their papers at a nominal cost. Only those papers submitted by the manuscript due date will be included in the STP.
Please note that all submitted papers are subject to single blind peer review and will be submitted to the Library of Congress with an ISBN number and will be reviewed for inclusion in the "Thomson & Reuters Web of Science's Conference Proceedings Citation Index" (CPCI) and Google Scholar.
Additional information about the symposium is available from Symposium Chairman Diana Fisler via email at email@example.com, or by phone at +1 303-378-9141; or Symposium Co-chair Marcin Pazera via email at firstname.lastname@example.org or by phone at +1 740-777-7256.