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A2LA Expands Services to Include Inspection Body Accreditation

The American Association for Laboratory Accreditation is expanding its services with the launch of its Inspection Body Accreditation Program. The inspection bodies eligible for the newly revised A2LA program include those inspecting food, vehicles, elevators, pressure vessels, buildings/structures, bulk products, welds, electrical equipment, and textiles. Inspection bodies can realize a market advantage by pursuing accreditation under the new program. A2LA intends to have its new program included in the next mutual recognition arrangement evaluation by the Asia Pacific Laboratory Accreditation Cooperation in 2006. Successful completion of the MRA evaluation would give international recognition to A2LA-accredited inspection bodies. Applications for accreditation can be found on the A2LA Web site or by contacting A2LA (phone: 301/644-3248).

NACLA 2005 Accreditation Forum to Be Held in April

The National Cooperation for Laboratory Accreditation will hold its annual Forum-General Meeting on April 5-6, 2005, in Columbia, Md. A major subject of the forum will be the new international standard for accreditation bodies (ISO/IEC 17011), which will take effect on Jan. 1, 2006. The preliminary program and registration form for the 2005 Forum-AGM will be available this month.

ISPE and FDA Cosponsor One-Day Forums on New PAT Guidance

The International Society for Pharmaceutical Engineering and the U.S. Food and Drug Administration are co-sponsoring a global series of one-day forums for life sciences professionals based on the FDA’s new guidance for process analytical technology. The document, entitled Guidance for Industry: A Framework for Innovative Pharmaceutical Development, Manufacturing, and Quality Assurance, provides a risk-based, regulatory context in which pharmaceutical and biopharmaceutical companies can improve efficiency and quality assurance through an improved focus on design and control. (ASTM formed a new technical committee, E55 on Pharmaceutical Application of Process Analytical Technology, earlier this year.) Two of the forums have already been held; the next two will be held in Brussels, Belgium, Feb. 22, 2005, and Mumbai, India, Feb. 25, 2005. The forums provide an overview of the tools and principles outlined in the new FDA guidance, and describe how these concepts can help organizations meet regulatory requirements for designing, controlling and optimizing the development, manufacturing and quality assurance processes. For additional information or to register for a forum, visit the Web site, or contact the ISPE Education Department (phone: 813/960-2105).

World Standards Day Paper Competition Winners

The Standards Engineering Society has announced the winners of the 2004 World Standards Day Paper Competition. This year’s theme was “Standards Connecting the World.” First place went to Alicia Clay and Michael D. Hogan for their paper, “Securely Connecting the World with Cyber Security Standards.” Clay is deputy chief, Computer Security Division, and Hogan is standards liaison, Information Technology Laboratory, both at the National Institute of Standards and Technology. William Rippey, an electronics engineer, Intelligent Systems Division, Manufacturing Engineering Laboratory, also at NIST, won second place for his paper, “We Need Better Information Connections for Welding Manufacturing.” The third place prize was awarded to Gordon Gillerman of Underwriters Laboratories, who is currently seconded to NIST as conformity assessment advisor – homeland security, who wrote the paper, “Making the Confidence Connection: Conformity Assessment System Design,” which appears on page 22 of this issue of SN. The winning papers were originally published in Standards Engineering and will be available on the SES Web site. Check the SES Web site in the future for entry forms, along with a complete set of rules and eligibility requirements, for the 2005 World Standards Day paper competition.

Lightweight Materials for Defense

ASTM International is a cosponsor of the Institute for Defense and Government Advancement’s 3rd Annual Conference on Lightweight Materials for Defense, to be held Feb. 28-March 2, 2005, in Arlington, Va. Future weapons systems will require the use of lighter materials that can still survive the rigors of battle. The U.S. Army is focusing on the benefits of using high-strength, lightweight materials, examining manufacturing processes and materials that could reduce vehicle weight and improve fuel efficiency. The U.S. Air Force is relying on lightweight composite structures as it rolls out high performance aircraft. And a program spearheaded by the Office of Naval Research, the Expeditionary Systems Material program, will help develop marine vehicles that are lighter and tougher, leveraging nanotechnology. IDGA’s 3rd Annual Lightweight Materials for Defense conference will feature speakers from the Army, Air Force, Navy, and Marine Corps who will address the technology revolution taking place and shed light on the contributions that can be made by the defense industry.

Monograph on “Seismic Hazard and Risk Analysis” Available from EERI

The Earthquake Engineering Research Institute has published a 240-page hardcover monograph entitled Seismic Hazard and Risk Analysis by Robin K. McGuire. It is a general introduction to methods of seismic hazard and risk analysis and includes a glossary of standard symbols. Potentially large losses justify the significant effort involved in a seismic risk assessment, and a formal assessment allows the disciplines of seismology, geology, strong-motion geophysics, and earthquake engineering to communicate through a common language of best estimates and uncertainties. This book is a compilation of how these disciplines contribute to the evaluation of seismic risk. Contact EERI (phone: 510/451-0905; or see their Web site.) //

Copyright 2004, ASTM International