Electrical Insulation and Electronics


    D69-12 - Standard Test Methods for Friction Tapes

    D115-17 - Standard Test Methods for Testing Solvent Containing Varnishes Used for Electrical Insulation

    D117-10 - Standard Guide for Sampling, Test Methods, and Specifications for Electrical Insulating Oils of Petroleum Origin

    D120-14a - Standard Specification for Rubber Insulating Gloves

    D149-09(2013) - Standard Test Method for Dielectric Breakdown Voltage and Dielectric Strength of Solid Electrical Insulating Materials at Commercial Power Frequencies

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    Symposia Papers & STPs

    STP1530 Lead-free Solders

    STP1382 Gate Dielectric Integrity: Material, Process, and Tool Qualification

    STP1376 Electrical Insulating Materials: International Issues

    STP1340 Recombination Lifetime Measurements in Silicon

    STP1139 Acoustic Emission Testing of Aerial Devices and Associated Equipment Used in the Utility Industries

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    Manuals, Monographs & Data Series

    MONO2 Engineering Dielectrics: Volume III Electrical Insulating Liquids

    Journal of ASTM International (JAI)

    Wetting Behaviour and Evolution of Microstructure of Sn–Ag–Zn Solders on Copper Substrates with Different Surface Textures

    Empirical Modeling of the Time-Dependent Structural Build-up of Lead-Free Solder Pastes Used in the Electronics Assembly Applications

    Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling

    The Microstructural Aspect of the Ductile-to-Brittle Transition of Tin-Based Lead-Free Solders

    Wetting Behavior of Solders

    View Most Recent 25 JAI papers    View All JAI papers

    Journal of Testing and Evaluation (JTE)

    Correlation Between Machinability and Chip Morphology of Austempered Ductile Iron

    Electromagnetic Crimping in Tube-to-Cylinder Configuration: Influence of the Base Profiles on the Joint Quality

    Evaluation of Nano-ZnO Dispersed State in Bitumen with Digital Imaging Processing Techniques

    Development of Cuttability Abacuses in Abrasive Waterjet Cutting With Regard to Depth of Cut and Roughness of Cut Surfaces

    The Material Dispatching Method for Conveyor System in 450 mm Wafer Fabrication

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