Electronics; Declarable Substances in Materials

    Symposia Papers & STPs

    STP1530 Lead-free Solders

    STP1382 Gate Dielectric Integrity: Material, Process, and Tool Qualification

    STP1340 Recombination Lifetime Measurements in Silicon

    STP1141 Laser-Induced Damage in Optical Materials: 1990

    STP990 Semiconductor Fabrication: Technology and Metrology

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    Journal of ASTM International (JAI)

    Wetting Behaviour and Evolution of Microstructure of Sn–Ag–Zn Solders on Copper Substrates with Different Surface Textures

    Empirical Modeling of the Time-Dependent Structural Build-up of Lead-Free Solder Pastes Used in the Electronics Assembly Applications

    Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling

    The Microstructural Aspect of the Ductile-to-Brittle Transition of Tin-Based Lead-Free Solders

    Wetting Behavior of Solders

    View Most Recent 25 JAI papers    View All JAI papers


    Journal of Testing and Evaluation (JTE)

    Development of Cuttability Abacuses in Abrasive Waterjet Cutting With Regard to Depth of Cut and Roughness of Cut Surfaces

    The Material Dispatching Method for Conveyor System in 450 mm Wafer Fabrication

    Digital Implementation of Neuro-Fuzzy System for Image Processing Functions

    Constructing an Evaluation Model to Assess the Supply Chain Management System in the Taiwan Semiconductor Industry

    A Certain Investigation on Harmonic Reduction and Design of Fuzzy Gain Scheduler for Shunt Compensation for Power Quality Enhancement

    View Most Recent 25 JTE papers    View All JTE papers