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    Prediction of Failures in Service by Photoelastic Methods

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    The technique of photoelasticity has been used basically as a stress analysis tool. More recently, its application to failure prediction has found extensive application, and it has become a powerful and economical approach in solving the failure analysis problem. Some areas of application are discussed in this article, including defect detection, residual stress measurement, effect of assembly stresses, service overloads, and proof testing.


    photoelastic, residual, yielding, design, stress, failure, tests

    Author Information:

    Redner, S.
    PresidentPersonal member of ASTM, Photolastic, Inc., a subsidiary of Vishay Intertechnology, Inc., Malvern, Pa.

    Committee/Subcommittee: E08.03

    DOI: 10.1520/STP48453S