| ||Format||Pages||Price|| |
|PDF (396K)||12||$25||  ADD TO CART|
|Complete Source PDF (8.9M)||213||$66||  ADD TO CART|
Cite this document
Temperature, current density, and other process variables influence the properties and the structures of electroformed copper. The effects of only a few addition agents have been evaluated. Data on the effects of impurities are lacking. Structures of typical electroformed copper are correlated in this discussion with the available data on properties.
Safranek, W. H.
Battelle Memorial Inst., Columbus, Ohio