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    Physical and Mechanical Properties of Electroformed Copper

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    Temperature, current density, and other process variables influence the properties and the structures of electroformed copper. The effects of only a few addition agents have been evaluated. Data on the effects of impurities are lacking. Structures of typical electroformed copper are correlated in this discussion with the available data on properties.

    Author Information:

    Safranek, W. H.
    Battelle Memorial Inst., Columbus, Ohio

    Committee/Subcommittee: B08.08

    DOI: 10.1520/STP46003S