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    Effect of Impurities on Some Properties of Lead-Tin Alloys

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    A research investigation on the effects of the common impurities on the soldering properties of various lead-tin alloys is described in detail Observations of these effects after carefully measured additions of antimony, arsenic, bismuth, silver, copper, phosphorus, and sulfur are compiled and discussed Reliable conclusions can be drawn about the quality of a solder by hotdipping steel, brass, or copper into a molten pool of such an alloy The tolerable limits of impurities in an all-purpose solder were determined to be: antimony, 0.4 per cent; arsenic, 0.02 per cent; copper, 0.06 per cent; phosphorus and sulfur, as low as possible, preferably nil.

    Author Information:

    Heberlein, Max F. W.
    U. S. Metals Refining Co., Carteret, N. J.

    Committee/Subcommittee: B02.10

    DOI: 10.1520/STP45808S