You are being redirected because this document is part of your ASTM Compass® subscription.
    This document is part of your ASTM Compass® subscription.


    Proposed Numerical Evaluation System for Soft Solders, Solder Fluxes, and Solderability

    Published: 0

      Format Pages Price  
    PDF (444K) 16 $25   ADD TO CART
    Complete Source PDF (4.6M) 195 $60   ADD TO CART


    In the numerical evaluation system described in this paper, the nominal diameter of a sphere formed by a standardized solder specimen provides the zero per cent mark; the infinite thinness of the same solder mass spread as a film provides the 100 per cent mark, on a percentage scale. Intermediate values are determined by measurement of the height or thickness of the solder spots, obtained after melting, by means of a hand micrometer. The empirical spread-factor values thus obtained provide a simple, reproducible, visually significant numerical system. A general relationship to cos ϑ, where ϑ is the contact angle between liquid solder and solid base, is shown. Applications of this system for the evaluation of solders, fluxes, and metallic surfaces with respect to solderability are given.

    Author Information:

    Pessel, L.
    Components Div., Radio Corporation of America, Camden, N. J.

    Committee/Subcommittee: B02.02

    DOI: 10.1520/STP44118S