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    Ultrasonic Soldering of Aluminum

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    Ultrasonic techniques permit soldering of aluminum without the use of any fluxes whatsoever, with the elimination of corrosion attack resulting from flux residue or inadequate cleaning after soldering. Using these techniques, aluminum joints were fabricated with three binary solder alloys and two ternary alloys and were exposed to two corrosion media—hot aerated distilled water and salt water.

    Data showing the decay of joint strength as a function of time of each solder in each environment are presented. Corrosion attack was observed to cause separation of the joints along the solder-aluminum interface. This localized penetration has been explained on the basis of a high galvanic potential at the interface resulting from the diffusion of solder constituents into the aluminum.

    There are many applications for soldered aluminum assemblies where corrosion is not a factor or where selection of a suitable solder permits reasonable life in a corrosive environment. Ultrasonic equipment is available covering a broad range of applications, from diminutive precise devices for silicon transistor connections to large units for continuous coating of metal strip materials.

    Author Information:

    Jones, J. Byron
    Aeroprojects, Inc., West Chester, Pa

    Thomas, John G.
    Aeroprojects, Inc., West Chester, Pa

    Committee/Subcommittee: B02.02

    DOI: 10.1520/STP44105S