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This paper describes several interesting effects observed during evaluation of various procedures and solvents for cleaning electronic components used in micromodules. Cleaning is performed on partially fabricated components prior to the application of the encapsulant. All traces of flux and other contaminants must be removed from the components before encapsulation to ensure the high reliability required of each element and to provide a surface compatible with the final encapsulant.
Two cleaning methods were used in the tests. Each method was applied to 12 different components, including high-stability metal-film resistors, solid electrolytic tantalum capacitors, four types of ceramic capacitors, inductors having two different core materials, diodes similar to the 1N277 and 1N643, and transistors similar to the 2N404. Special emphasis was placed on the components which showed large changes in electrical chracteristics after cleaning. The method that removed the maximum amount of contaminants without damaging the components was selected. A complete analysis of the effect of the cleaning methods on each component is given, and the measures used to overcome damaging effects are outlined.
Vossen, J. L.
Radio Corp. of America, Somerville, N. J.