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    Evaluation of Methods for Performing Adhesion Measurements of Thick-Film Terminations on Chip Components

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    The nailhead lead tension test is shown to be a very useful method of measuring the adhesion strength of thick film, solderable end terminations on chip resistors, and multilayer monolithic ceramic capacitors. Alternative test concepts are considered and detailed comparisons are presented. Specimen preparation and test parameters are defined, and the effects of variation in termination configuration are illustrated. It was found that attachment parameters must be well defined and followed so as not to introduce other variables in measured strengths. The test criteria defined in this paper can be applied to other specific devices, but limits for their use must be individually established. The data provide application limits for some commonly used chip components.


    adhesion, adhesion tests, resistors, ceramic capacitors, terminations, passive components, tension tests, shear tests, thick-film inks

    Author Information:

    Ewell, GJ
    Head, Inorganic Materials Section, Technology Support Division, Hughes Aircraft Company, Culver City, Calif.

    Committee/Subcommittee: C24.30

    DOI: 10.1520/STP38636S